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半導體器件可靠性

維基百科,自由的百科全書

半導體器件可靠性可以歸納為以下幾點:

  1. 半導體器件對雜質和灰塵很敏感。所以在繁複的生產工藝中,精確控制雜質和灰塵的等級是非常必要的。最終產品的質量很大程度上依靠生產中的各個相對獨立而又相互影響的生產階段,例如金屬化(metallization),晶片材料(chip material), 封裝等。
  2. 由於技術飛速進步,新材料和新工藝不斷被用於新研發的器件中,設計時間表根據非循環工程常數(non-recurring engineering)限定,再加上市場對設計時間不斷提出苛刻要求,所以可靠性設計基本不可能按照已有的產品進行。
  3. 為達到一定的經濟指標,半導體產品總是大批量生產的;並且修理半導體產成品也是不實際的。所以半導體產品在設計階段加入可靠性的概念和在生產階段減少變量就成為十分必要的要求。
  4. 半導體器件可靠性取決於裝配,使用,環境狀況。影響因素包括氣體灰塵沾污電壓電流密度溫度濕度應力,往復振動,劇烈震盪壓強電磁場的強度。

設計方面影響半導體器件可靠性的因素包括:電壓衰退,功率衰退,電流衰退,穩定性邏輯時間變差(logic simulation),時效分析(timing analysis),溫度衰退和工藝控制

提高方法

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半導體器件可靠性依靠以下方法保證其處於高水準:

  1. 潔淨車間內生產,以控制雜質。
  2. 嚴格的工藝控制,減少變量。
  3. 老化(短時間,極端條件下運轉)並測試以減少不合格品漏過。
  4. 半導體晶片測試,指在封裝前,用連接測試設備的探針,在顯微設備下接觸晶片並進行測試,去除不合格品。
  5. 用整套參數測試封裝後的半導體器件,確保產品能正常運作。

參考文獻

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  • Giulio Di Giacomo (Dec 1, 1996), Reliability of Electronic Packages and Semiconductor Devices, McGraw-Hill
  • A. Christou and B.A. Unger (Dec 31, 1989), Semiconductor Device Reliability, NATO Science Series E
  • Michael Pecht, Riko Radojcic, and Gopal Rao (Dec 29, 1998), Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series), CRC Press LLC
  • MIL-HDBK-217F Reliability Prediction of Electronic Equipment
  • MIL-HDBK-251 Reliability/Design Thermal Applications
  • MIL-HDBK-H 108 Sampling Procedures and Tables for Life and Reliability Testing (Based on Exponential Distribution)
  • MIL-HDBK-338 Electronic Reliability Design Handbook
  • MIL-HDBK-344 Environmental Stress Screening of Electronic Equipment
  • MIL-STD-690C Failure Rate Sampling Plans and Procedures
  • MIL-STD-721C Definition of Terms for Reliability and Maintainability
  • MIL-STD-756B Reliability Modeling and Prediction
  • MIL-HDBK-781 Reliability Test Methods, Plans and Environments for Engineering Development, Qualification and Production
  • MIL-STD-1543B Reliability Program Requirements for Space and Missile Systems
  • MIL-STD-1629A Procedures for Performing a Failure Mode, Effects, and Criticality Analysis
  • MIL-STD-1686B Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
  • MIL-STD-2074 Failure Classification for Reliability Testing
  • MIL-STD-2164 Environment Stress Screening Process for Electronic Equipment