窄带隙半导体
外观
窄带隙半导体是指带隙小于0.5 eV,或红外吸收截止波长超过2.5微米的半导体材料。更广义的定义包括带隙小于硅(1.1 eV)的所有半导体。[1] [2] 现代太赫兹[3]、红外[4] 和热成像[5] 技术均基于此类半导体。
窄带隙材料应用于红外探测器和红外领域,以实现卫星遥感[6]、远程通讯的光子集成电路[7] [8] [9] 和无人驾驶车辆的Li-Fi系统[10] [11] [12] [13]。这种半导体材料也是太赫技术的材料基础,其应用包括探测隐藏武器的安全监视系统[14] [15] [16]、太赫兹断层扫描的安全医疗和工业成像系统 [17] [18] [19],以及介电尾场加速器[20] [21] [22]。 此外,嵌入窄带隙半导体的热光伏 发电可讲传统太阳能发电系统中浪费的部分能量转化为可用电能,该部分能量占据了太阳光谱的49%左右[23] [24]。 航天和深海应用,以及真空物理装置中,常使用窄带隙半导体来实现超低温冷却。[25] [26]
在尖端研发中,窄带隙半导体被制成纳米材料,其强烈的电子空穴耦合会与增加的量子限制效应相互作用[27],这给描述和设计带来了特殊的挑战。麻省理工学院的兰克斯提出的“兰克斯模型”扩展了k·p 方法来解决电子能带边缘的非抛物线性问题,但又缺乏精确性[28]。 使用超级计算机利用密度泛函理论进行第一性原理计算,虽然可以得到更精确的能带曲率,但其对算力和算时的要求都太大。 唐爽和崔瑟豪斯夫人提出的“唐-崔瑟豪斯理论”[29] [30] 引入了一种低维多带迭代法,以渐进式方法解决了这个问题,并得到了通用汽车的数据支持。[31] [32]
![](http://upload.wikimedia.org/wikipedia/commons/thumb/e/e7/MIT20120424.jpg/220px-MIT20120424.jpg)
窄带隙半导体列表
[编辑]材料 化学式 族 能隙 (300 K) 碲化汞鎘 Hg1−xCdxTe II-VI 0 to 1.5 eV 碲化汞鋅 Hg1−xZnxTe II-VI 0.15 to 2.25 eV 硒化铅 PbSe IV-VI 0.27 eV 硫化铅 PbS IV-VI 0.37 eV 碲化铅 PbTe IV-VI 0.32 eV 砷化铟 InAs III-V 0.354 eV 锑化铟 InSb III-V 0.17 eV 銻化鎵 GaSb III-V 0.67 eV 砷化鎘 Cd3As2 II-V 0.5 to 0.6 eV 碲化鉍 Bi2Te3 0.21 eV 碲化亚锡 SnTe IV-VI 0.18 eV 硒化亚锡 SnSe IV-VI 0.9 eV 硒化银 Ag2Se 0.07 eV 矽化鎂 Mg2Si II-IV 0.79 eV[33]
相關條目
[编辑]参考
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- 多恩豪斯,R.,尼姆茨,G.,施利希特,B.(1983)。窄带隙半导体。施普林格现代物理学小册子98 ,ISBN 978-3-540-12091-9 (打印)ISBN 978-3-540-39531-7 (在线)
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